Hitachi Chemical Co. (Hong Kong) Ltd.

This is a film type resist that is which applied onto the copper-clad laminate to create circuits for the printed wiring boards. This features high sensitivity, high resolution, and high adhesion with strong tenting ability to create high density patterns.

Hitachi Chemicals was the first company in the world to develop these circuit connecting materials for displays. They satisfy both conductivity and insulation performance (anisotropic conductivity) owing to adhesives with conductive particles, enable the connection of numerous minute electrodes at a time, and are used widely in devices such as PCs, cell phones, LCDs, and plasma TVs.

Encapsulation materials are packaging materials that protect semiconductor chips from heat, moisture, dust and physical impacts. While responding to diversifying semiconductor packaging and environmental issues, we offer products that meet our customers' requirements.

These materials are made by impregnating glass cloth with epoxy resin and then laminating copper foil on both sides, and are used in multilayer printed wiring boards (PWBs). The high-Tg glass epoxy copper-clad laminates maintain excellent FR-4 characteristics and at the same time realize high heat resistance and low moisture-absorption.

Excellent moisture-resistance enables these products to protect electrodes in such devices as LCDs from moisture. Since the coating has low moisture-permeability and few ionic impurities, it demonstrates excellent migration resistance and contributes to the reliability of the finished devices.

This is used as part of the LCD's backlight unit and illustrates the display by reflecting light emitted from the edge-mounted LEDs in a direction perpendicular to the display. It adopts single-piece fabrication technology to integrate unique holographic patterns and microreflective grooves and contributes to a higher level of brightness and reduces the uneven light that characterize LED. It is used widely for color displays in cell phones.

These are new ultra-thin, flexible base material for multi-layer PWBs. The products have excellent dimensional stability and heat resistance, and also correspond to the process of lead-free solder. With their flexibility in space-constrainted installations, the products contribute the design degree of freedom of portable digital devices.

These are environmentally friendly copper-clad laminates that are made without the use of halogenated flame retardant, antimony or red phosphorus. They have excellent features in heat resistance, machine processability, adhesiveness and formability, and are also suitable for lead-free soldering.

These products form resist layers over the flexible circuits and contribute to improve electrical insulation and mechanical durability. They cure at low temperatures and those cured coatings have high elongation, therefore they demonstrate excellent adhesion to the sealants and have bending resistance.

These are electrical insulating varnishes for impregnating coils in various motors and transformers, and for enameled copper wire. We provide a wide range of products that boast outstanding characteristics required for various electric appliances, such as high heat resistance, durability and adhesiveness.

These laminators cut photosensitive dry films precisely to the size of the substrate, apply linings and laminates with high precision in a high-speed automatic operation.