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In the growing emergence of IT in business and society, Hitachi serves as a supplier to provide various advanced equipments such as metals and cable, and contributes to the development of the contemporary society.
Metals
IC lead frame Materials
According to customer's needs, we supplied various size's IC lead frame materials.
Suputtering target materials
Unique new materials are developed and supplied for use in liquid crystal displays,hard disk drives and other next-generation applications.
Magnets
A variety of high-performance products are supplied, including the world's top brand NEOMAX® rare-earth magnets,as well as ferrite and alnico magnets.
Metglas® amorphous metal materials
Soft magnetic materials save electric energy consumption by reducing the loss from transformers and related devices,thereby contributing to the reduction of CO2 emissions.
FINEMET® nanocrystalline soft magnetic materials
FINEMET® nanocrystalline soft magnetic materials developed by Hitachi Metals are used in products we supply to reduce electromagnetic noise,including electromagnetic compatibility (EMC),and power electronics components.
Components for information and communications devices
These components help reduce the size and weight of mobile phones and other devices.
Cable
UL WIRES & CABLES
Hitachi Cable, Ltd. is one of the leading manufacturers and suppliers of electronic wire and cable in Japan. We cover a wide range of products including UL/CSA approved PVC insulated wire, flat ribbon wire, and shield wire for the internal wiring of consumer equipment. In addition, we produce miniature coaxial cable and multi core/pair interface cable for the computer industry, medical equipment, and industrial machinery. Furthermore, we have the flexibility to supply custom designed cables to meet your requirements due to our highly diversified manufacturing capabilities.
WIRELESS ANTENNA
Antenna for Mobile Phone Base Satations; Antenna Systerms for Terrestirial Ditigal Broadcasting; Antenna for Wireless Access.
FLEXIBLE FLAT CABLE (FFC)
CUJ(0.5) . CUJ(0.8) . CUJ(1.0) . CUJ(1.25)
Shielded FFC(AL/PET)
Shielded FFC(CU/PET)
MAGNET WIRE
Under the current tendency deployment of inverter-fed motor is increasing, an evolutional magnet wire is fatally requested.
It has to include two main characteristics of high stability to partial discharge and high flexibility for winding.
LEAD FRAMES
FPD Field->COF Tape for LCD; Semiconductor Package Interposer Field: TAB tape for CSP, TAB tape for TBGA, uBGA® package, MITT®
MICRO COAXIAL CABLE
MCX UL1354, UL21162 for Internal wiring of electronic equipment, e.g. notebook computer, mobile phone enquipment, LCD etc.
RUBBER ROLLER
We produce safe, high-reliability automotive parts in an integrated production process that has supplied car manufactures with brake hose assemblies, power steering hose assemblies, air conditioning hoses and emission control hoses. All our rubber products surpass world standards for durability and resistance to both high pressure and extreme weather conditions.
OPTICAL TRANSCEIVER
SONET/SDH; Fibre Channel; Gigabit Ethernet; CWDM/DWDM
COPPER STRIP
Hitachi Cable,Ltd. consistently supplies high-quality products to the global market through leading-edge development efforts and highly sophisticated technologies. Fully integrated production systems turn out wide varieties of Cu / Cu alloy strips for semiconductors, electrical and other uses.
Chemical Materials
Photosensitive dry films for printed wiring boards (Photec)
This is a film type resist that is which applied onto the copper-clad laminate to create circuits for the printed wiring boards. This features high sensitivity, high resolution, and high adhesion with strong tenting ability to create high density patterns.
Anisotropic conductive films
Hitachi Chemicals was the first company in the world to develop these circuit connecting materials for displays. They satisfy both conductivity and insulation performance (anisotropic conductivity) owing to adhesives with conductive particles, enable the connection of numerous minute electrodes at a time, and are used widely in devices such as PCs, cell phones, LCDs, and plasma TVs.
Epoxy molding compounds,Liquid encapsulants
Encapsulation materials are packaging materials that protect semiconductor chips from heat, moisture, dust and physical impacts. While responding to diversifying semiconductor packaging and environmental issues, we offer products that meet our customers' requirements.
High-Tg glass epoxy copper-clad laminates for multilayer PWBs
These materials are made by impregnating glass cloth with epoxy resin and then laminating copper foil on both sides, and are used in multilayer printed wiring boards (PWBs). The high-Tg glass epoxy copper-clad laminates maintain excellent FR-4 characteristics and at the same time realize high heat resistance and low moisture-absorption.
Moisture resistance insulating material for FPD
Excellent moisture-resistance enables these products to protect electrodes in such devices as LCDs from moisture. Since the coating has low moisture-permeability and few ionic impurities, it demonstrates excellent migration resistance and contributes to the reliability of the finished devices.
Holographic lightguide for backlight unit
This is used as part of the LCD's backlight unit and illustrates the display by reflecting light emitted from the edge-mounted LEDs in a direction perpendicular to the display. It adopts single-piece fabrication technology to integrate unique holographic patterns and microreflective grooves and contributes to a higher level of brightness and reduces the uneven light that characterize LED.
It is used widely for color displays in cell phones.
Ultra-thin multilayer printed wiring board base materials
These are new ultra-thin, flexible base material for multi-layer PWBs. The products have excellent dimensional stability and heat resistance, and also correspond to the process of lead-free solder. With their flexibility in space-constrainted installations, the products contribute the design degree of freedom of portable digital devices.
Advanced function, environmentally friendly FR-4 copper-clad laminates for multilayer PWBs
These are environmentally friendly copper-clad laminates that are made without the use of halogenated flame retardant, antimony or red phosphorus. They have excellent features in heat resistance, machine processability, adhesiveness and formability, and are also suitable for lead-free soldering.
Thermosetting polyimide solder resist for COF
These products form resist layers over the flexible circuits and contribute to improve electrical insulation and mechanical durability. They cure at low temperatures and those cured coatings have high elongation, therefore they demonstrate excellent adhesion to the sealants and have bending resistance.
Electrical insulating varnishes
These are electrical insulating varnishes for impregnating coils in various motors and transformers, and for enameled copper wire.
We provide a wide range of products that boast outstanding characteristics required for various electric appliances, such as high heat resistance, durability and adhesiveness.