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Hitachi

Hitachi in Hong Kong

Corporate Information

Corporate Name Hitachi Chemical Co. (Hong Kong) Ltd.
Address Unit 703, 7/F, Building 20E, Phase 3, Hong Kong Science Park, Pak Shek Kok, New Territories, Hong Kong
TEL +852-2366-9304
FAX +852-2723-3549
Founded 1974-3-26
Business Overview Marketing of Hitachi Chemical products
Slitting operation and marketing of photosensitive dry films for printed wiring boards

Map of corporate

Office Picture

picture:  Office Picture

Major Products & Business Overview

Photosensitive dry films for printed wiring boards (Photec)

picture:  Photosensitive dry films for printed wiring boards (Photec)

This is a film type resist that is which applied onto the copper-clad laminate to create circuits for the printed wiring boards. This features high sensitivity, high resolution, and high adhesion with strong tenting ability to create high density patterns.

Anisotropic conductive films

picture:  Anisotropic conductive films

Hitachi Chemicals was the first company in the world to develop these circuit connecting materials for displays. They satisfy both conductivity and insulation performance (anisotropic conductivity) owing to adhesives with conductive particles, enable the connection of numerous minute electrodes at a time, and are used widely in devices such as PCs, cell phones, LCDs, and plasma TVs.

Epoxy molding compounds
Liquid encapsulants

picture:  Epoxy molding compounds Liquid encapsulants

Encapsulation materials are packaging materials that protect semiconductor chips from heat, moisture, dust and physical impacts. While responding to diversifying semiconductor packaging and environmental issues, we offer products that meet our customers' requirements.

High-Tg glass epoxy copper-clad laminates for multilayer PWBs

picture:  High-Tg glass epoxy copper-clad laminates for multilayer PWBs

These materials are made by impregnating glass cloth with epoxy resin and then laminating copper foil on both sides, and are used in multilayer printed wiring boards (PWBs). The high-Tg glass epoxy copper-clad laminates maintain excellent FR-4 characteristics and at the same time realize high heat resistance and low moisture-absorption.

Moisture resistance insulating material for FPD

picture:  Moisture resistance insulating material for FPD

Excellent moisture-resistance enables these products to protect electrodes in such devices as LCDs from moisture. Since the coating has low moisture-permeability and few ionic impurities, it demonstrates excellent migration resistance and contributes to the reliability of the finished devices.

Advanced function, environmentally friendly FR-4 copper-clad laminates for multilayer PWBs

picture:  Advanced function, environmentally friendly FR-4 copper-clad laminates for multilayer PWBs

These are environmentally friendly copper-clad laminates that are made without the use of halogenated flame retardant, antimony or red phosphorus. They have excellent features in heat resistance, machine processability, adhesiveness and formability, and are also suitable for lead-free soldering.

Thermosetting polyimide solder resist for COF

picture:  Thermosetting polyimide solder resist for COF

These products form resist layers over the flexible circuits and contribute to improve electrical insulation and mechanical durability. They cure at low temperatures and those cured coatings have high elongation, therefore they demonstrate excellent adhesion to the sealants and have bending resistance.

Electrical insulating varnishes

picture:  Electrical insulating varnishes

These are electrical insulating varnishes for impregnating coils in various motors and transformers, and for enameled copper wire. We provide a wide range of products that boast outstanding characteristics required for various electric appliances, such as high heat resistance, durability and adhesiveness.

Auto-cut laminators

picture:  Auto-cut laminators

These laminators cut photosensitive dry films precisely to the size of the substrate, apply linings and laminates with high precision in a high-speed automatic operation.